818-AG11D-ESL-LF - CONN IC DIP SOCKET 18POS GOLD
Nombor Bahagian pengilang
Nombor Bahagian dalaman
pengeluar
Penerangan ringkas
CONN IC DIP SOCKET 18POS GOLD
Rosh Status
Memimpin percuma / RoHS Compliant
Masa penghantaran
1-2 hari
kuantiti disediakan
208745 Pieces
Harga rujukan
Harga kami
- (Sila hubungi kami untuk harga yang lebih baik: [email protected])
- AX Semiconductor mempunyai 818-AG11D-ESL-LF dalam stok untuk menjual.
- Pilihan penghantaran dan penghantaran masa:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Pilihan pembayaran:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
spesifikasi bagi 818-AG11D-ESL-LF
Jaminan kualiti :
jaminan 365 hari
Sumber saham :
Francais Pengedar / Pengilang Direct
Negara asal :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nombor Bahagian :
818-AG11D-ESL-LF
pengeluar :
TE Connectivity AMP Connectors
Penerangan :
CONN IC DIP SOCKET 18POS GOLD
Siri :
800
Status Bahagian :
Active
Taipkan :
DIP, 0.3" (7.62mm) Row Spacing
Bilangan Jawatan atau Pins (Grid) :
18 (2 x 9)
Pitch - Mating :
0.100" (2.54mm)
Hubungi Selesai - Kawin :
Gold
Hubungi Selesai Kemasan - Mating :
Flash
Bahan Hubungi - Mating :
Beryllium Copper
Jenis Pemasangan :
Through Hole
ciri-ciri :
Open Frame
Penamatan :
Solder
Pitch - Post :
0.100" (2.54mm)
Hubungi Selesai - Hantar :
Gold
Hubungi Selesai Tebal - Pos :
Flash
Bahan Hubungi - Pos :
Copper
Bahan Perumahan :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Suhu Operasi :
-55°C ~ 105°C
Berat :
-
Keadaan :
Baru dan asli
dokumen untuk 818-AG11D-ESL-LF
Helaian data :
818-AG11D-ESL-LF.pdf
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