ESQ-136-39-G-T-LL - CONN SOCKET 108POS 0.1 GOLD PCB

Nombor Bahagian pengilang

ESQ-136-39-G-T-LL

Nombor Bahagian dalaman

AX-ESQ-136-39-G-T-LL

pengeluar

Samtec Inc.

Penerangan ringkas

CONN SOCKET 108POS 0.1 GOLD PCB

Rosh Status

Memimpin percuma / RoHS Compliant

Masa penghantaran

1-2 hari

kuantiti disediakan

38484 Pieces

Harga rujukan

~~USD 8.748~~

Harga kami

- (Sila hubungi kami untuk harga yang lebih baik: [email protected])

AX Semiconductor mempunyai ESQ-136-39-G-T-LL dalam stok untuk menjual.

Pilihan penghantaran dan penghantaran masa:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Pilihan pembayaran:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasi bagi ESQ-136-39-G-T-LL

Jaminan kualiti : jaminan 365 hari

Sumber saham : Francais Pengedar / Pengilang Direct

Negara asal : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nombor Bahagian : ESQ-136-39-G-T-LL

pengeluar : Samtec Inc.

Penerangan : CONN SOCKET 108POS 0.1 GOLD PCB

Siri : ESQ

Status Bahagian : Active

Jenis Penyambung : Elevated Socket

Jenis Kenalan : Forked

Gaya : Board to Board

Bilangan Jawatan : 108

Bilangan Jawatan Dimuatkan : All

Pitch - Mating : 0.100" (2.54mm)

Bilangan baris : 3

Barisan Baris - Kawin : 0.100" (2.54mm)

Jenis Pemasangan : Through Hole

Penamatan : Kinked Pin, Solder

Jenis Pengikat : Push-Pull

Hubungi Selesai - Kawin : Gold

Hubungi Selesai Kemasan - Mating : 20.0µin (0.51µm)

Warna Penebat : Black

Ketinggian penebat : 0.435" (11.05mm)

Panjang Hubungi - Pos : 0.480" (12.19mm)

Suhu Operasi : -55°C ~ 125°C

Penilaian Kemaparatan Bahan : UL94 V-0

Hubungi Selesai - Hantar : Gold

Mated Stacking Heights : -

Perlindungan kemasukan : -

ciri-ciri : -

Penilaian Semasa : 5.7A per Contact

Penilaian Voltan : 550VAC

Berat : -

Keadaan : Baru dan asli

Pautan Berkaitan : ESQ-1 , ESQ-136-

dokumen untuk ESQ-136-39-G-T-LL

Helaian data : ESQ-136-39-G-T-LL.pdf

produk berkaitan untuk ESQ-136-39-G-T-LL Samtec Inc.

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