BDN13-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.31SQ

Nombor Bahagian pengilang

BDN13-3CB/A01

Nombor Bahagian dalaman

AX-BDN13-3CB/A01

pengeluar

CTS Thermal Management Products

Penerangan ringkas

HEATSINK CPU W/ADHESIVE 1.31SQ

Rosh Status

Memimpin percuma / RoHS Compliant

Masa penghantaran

1-2 hari

kuantiti disediakan

142560 Pieces

Harga rujukan

~~USD 1.968~~

Harga kami

- (Sila hubungi kami untuk harga yang lebih baik: [email protected])

AX Semiconductor mempunyai BDN13-3CB/A01 dalam stok untuk menjual.

Pilihan penghantaran dan penghantaran masa:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Pilihan pembayaran:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasi bagi BDN13-3CB/A01

Jaminan kualiti : jaminan 365 hari

Sumber saham : Francais Pengedar / Pengilang Direct

Negara asal : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nombor Bahagian : BDN13-3CB/A01

pengeluar : CTS Thermal Management Products

Penerangan : HEATSINK CPU W/ADHESIVE 1.31SQ

Siri : BDN

Status Bahagian : Active

Taipkan : Top Mount

Pakej Dingin : Assorted (BGA, LGA, CPU, ASIC...)

Kaedah Lampiran : Thermal Tape, Adhesive (Included)

Bentuk : Square, Pin Fins

Panjang : 1.310" (33.27mm)

Lebar : 1.310" (33.27mm)

Diameter : -

Ketinggian Base (Ketinggian Fin) : 0.355" (9.02mm)

Pengasingan Kuasa @ Suhu Meningkat : -

Rintangan Termal @ Aliran Udara Paksa : 6.00°C/W @ 400 LFM

Rintangan Thermal @ Natural : 16.10°C/W

Bahan : Aluminum

Selesai Bahan : Black Anodized

Berat : -

Keadaan : Baru dan asli

Pautan Berkaitan : BDN1 , BDN13-

dokumen untuk BDN13-3CB/A01

Helaian data : BDN13-3CB/A01.pdf

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