ESQT-129-02-F-S-780 - CONN SOCKET 29POS 0.079 GOLD PCB

Nombor Bahagian pengilang

ESQT-129-02-F-S-780

Nombor Bahagian dalaman

AX-ESQT-129-02-F-S-780

pengeluar

Samtec Inc.

Penerangan ringkas

CONN SOCKET 29POS 0.079 GOLD PCB

Rosh Status

Memimpin percuma / RoHS Compliant

Masa penghantaran

1-2 hari

kuantiti disediakan

77545 Pieces

Harga rujukan

~~USD 3.618~~

Harga kami

- (Sila hubungi kami untuk harga yang lebih baik: [email protected])

AX Semiconductor mempunyai ESQT-129-02-F-S-780 dalam stok untuk menjual.

Pilihan penghantaran dan penghantaran masa:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Pilihan pembayaran:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasi bagi ESQT-129-02-F-S-780

Jaminan kualiti : jaminan 365 hari

Sumber saham : Francais Pengedar / Pengilang Direct

Negara asal : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nombor Bahagian : ESQT-129-02-F-S-780

pengeluar : Samtec Inc.

Penerangan : CONN SOCKET 29POS 0.079 GOLD PCB

Siri : ESQT

Status Bahagian : Active

Jenis Penyambung : Elevated Socket

Jenis Kenalan : Forked

Gaya : Board to Board or Cable

Bilangan Jawatan : 29

Bilangan Jawatan Dimuatkan : All

Pitch - Mating : 0.079" (2.00mm)

Bilangan baris : 1

Barisan Baris - Kawin : -

Jenis Pemasangan : Through Hole

Penamatan : Solder

Jenis Pengikat : Push-Pull

Hubungi Selesai - Kawin : Gold

Hubungi Selesai Kemasan - Mating : 3.00µin (0.076µm)

Warna Penebat : Black

Ketinggian penebat : 0.780" (19.80mm)

Panjang Hubungi - Pos : 0.070" (1.78mm)

Suhu Operasi : -55°C ~ 125°C

Penilaian Kemaparatan Bahan : UL94 V-0

Hubungi Selesai - Hantar : Tin

Mated Stacking Heights : -

Perlindungan kemasukan : -

ciri-ciri : -

Penilaian Semasa : 4.5A per Contact

Penilaian Voltan : -

Berat : -

Keadaan : Baru dan asli

Pautan Berkaitan : ESQT-1 , ESQT-129-

dokumen untuk ESQT-129-02-F-S-780

Helaian data : ESQT-129-02-F-S-780.pdf

produk berkaitan untuk ESQT-129-02-F-S-780 Samtec Inc.

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